Boron plates

AC6043 Grade AC6043 is a titanium diboride/boron nitride composite that is machinable and exhibits better oxidation resistance and improved strength compared to common furnacing materials such as graphite. BNC 1 & 2 Grades BNC 1 & 2 offer excellent corrosion and wear resistance, have excellent thermal shock capability and low CTE, are non-wetting and are self lubricating. Applications: AC6043 is used in replacement parts for areas of high oxidation where longer life and much lower erosion rates are needed such as vents, plates, stacks, crucibles, and capsules. BNC 1 & 2 are useful in a broad range of metallurgical applications, including side dams, break rings, submerged nozzles, heat shields, spatter guards, stopper rods, slide gates, thermocouple wells and many other super refractory uses. Machining: AC6043, BNC1, and BNC2 can be machined using standard practices for hard ceramic materials, including diamond tooling with high cutting or grinding speeds and normal feed rates. Momentive Performance Materials produces over 75 standard and custom grades of BN powders to meet a wide range of application requirements, and has over 40 years of expertise in the synthesis and refinement of boron nitride powders.

Hot-pressed BN is compacted at temperatures up to 2000 C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom shapes and has several unique properties which make it valuable in a wide range of challenging industrial applications. Four Material Grades Grades HBC and HBT are our highest purity hot-pressed boron nitrides. They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applications. Grade HBT, although lower in strength and density than HBC, is available at lower cost and shorter lead times. Grade HBN uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concern. Grade HBR uses calcium borate as a strengthening binder and is moisture insensitive. For applications demanding even higher strength and durability, Momentive offers grade BIN77 composite material; see publication 81520 for more details. Thermal Management of Electronic Devices The unique combination of electrical resistivity and thermal conductivity makes BN an ideal heat sink in high power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finish. High Temperature Applications Temperature stability and excellent resistance to thermal shock make BN the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processing. Molten Metal Handling BN is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes. Location Delhi, Mumbai, Kolkata, Chennai, Bangalore, Pune, Ahmedabad, Vadodra,Surat, Vapi, Aurangabad, Kohlapur, Raigad, Raipur, Lucknow, Jaipur, Udaipur, Trivandrum, Coimbatore, Bhopal, Gurgaon, Raipur, Manesar, Bhubaneshwar, Jamshedpur, Hyderabad, Vizag, Vijayawada, Goa, Hosur, Nagpur, Rajkot, Kanpur, India Mob: 9910899409